@prefix ocrer: <http://purl.org/net/OCRe/research.owl#> .
@prefix owl:   <http://www.w3.org/2002/07/owl#> .
@prefix scires: <http://vivoweb.org/ontology/scientific-research#> .
@prefix xsd:   <http://www.w3.org/2001/XMLSchema#> .
@prefix skos:  <http://www.w3.org/2004/02/skos/core#> .
@prefix rdfs:  <http://www.w3.org/2000/01/rdf-schema#> .
@prefix ocresd: <http://purl.org/net/OCRe/study_design.owl#> .
@prefix swo:   <http://www.ebi.ac.uk/efo/swo/> .
@prefix cito:  <http://purl.org/spar/cito/> .
@prefix geo:   <http://aims.fao.org/aos/geopolitical.owl#> .
@prefix ocresst: <http://purl.org/net/OCRe/statistics.owl#> .
@prefix dcterms: <http://purl.org/dc/terms/> .
@prefix vivo:  <http://vivoweb.org/ontology/core#> .
@prefix event: <http://purl.org/NET/c4dm/event.owl#> .
@prefix vann:  <http://purl.org/vocab/vann/> .
@prefix foaf:  <http://xmlns.com/foaf/0.1/> .
@prefix c4o:   <http://purl.org/spar/c4o/> .
@prefix fabio: <http://purl.org/spar/fabio/> .
@prefix vcard: <http://www.w3.org/2006/vcard/ns#> .
@prefix thkoeln: <http://cris.nrw/hisinone#> .
@prefix vitro: <http://vitro.mannlib.cornell.edu/ns/vitro/0.7#> .
@prefix vitro-public: <http://vitro.mannlib.cornell.edu/ns/vitro/public#> .
@prefix rdf:   <http://www.w3.org/1999/02/22-rdf-syntax-ns#> .
@prefix ocresp: <http://purl.org/net/OCRe/study_protocol.owl#> .
@prefix bibo:  <http://purl.org/ontology/bibo/> .
@prefix obo:   <http://purl.obolibrary.org/obo/> .
@prefix ro:    <http://purl.obolibrary.org/obo/ro.owl#> .

obo:BFO_0000031  a  owl:Class ;
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        a       thkoeln:Zitat , owl:Thing .

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        a       thkoeln:Zitat , owl:Thing .

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thkoeln:Konferenzpaper
        a           owl:Class ;
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        a       thkoeln:Zitat , owl:Thing .

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<https://fis.th-koeln.de/vivo/individual/publ_13324>
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        rdfs:label              "RDF description of Review of Various Curing Processes and Techniques of Printed Circuit Board (PCB) and Introduction of New Innovative Thermal Curing Technique - https://fis.th-koeln.de/vivo/individual/publ_13324" , "Review of Various Curing Processes and Techniques of Printed Circuit Board (PCB) and Introduction of New Innovative Thermal Curing Technique" ;
        thkoeln:URL             "https://iwshm2023.stanford.edu/proceedings" ;
        thkoeln:sprache         "englisch" ;
        thkoeln:status          "validiert" ;
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                <https://fis.th-koeln.de/vivo/individual/FF_001> ;
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                <https://fis.th-koeln.de/vivo/individual/10000146> ;
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                <https://fis.th-koeln.de/vivo/individual/cite_13324-2> , <https://fis.th-koeln.de/vivo/individual/cite_13324-0> , <https://fis.th-koeln.de/vivo/individual/cite_13324-1> ;
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        <http://purl.org/dc/elements/1.1/rights>
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        bibo:abstract           "This paper examines the history of curing methods of Printed Circuit Boards (PCBs),   especially, the thermal-based curing method with its different curing process techniques.   In addition, highlighting its importance, hence, an incomplete curing process can lead   to delamination, cracking, or other failures, which render the PCB useless. Moreover,   various techniques used in the thermal-based curing method with their advantages will   be explained. Also, the limitations of each technique will be demonstrated, such as, long   curing times, uneven temperature distribution, high energy consumption, and absence of   the knowledge-base of different PCBs, like board volume, heating capacity, and electronic elements. Furthermore, factors that affect the thermal-based curing method like   type of material used, humidity, temperature, and time duration will be presented. So,   each factor must be carefully controlled to ensure that the curing process is effective and   consistent. In addition, a new innovative thermal-based curing approach will be introduced to overcome these limitations by using Artificial Intelligence (AI) techniques for   the indirect prediction of temperature on PCBs. The proposed approach involves the use   of new proper control based on AI technique to obtain an advanced control technique to   control the heating process of PCBs during the curing process. This new approach will   be developed during an ongoing research and development project." ;
        bibo:isbn13             "9781605956930" , "#defaultkonferenzband" ;
        bibo:pageEnd            "674" ;
        bibo:pageStart          "667" ;
        vitro:mostSpecificType  thkoeln:Konferenzpaper ;
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        rdfs:label  "Entität für Informationsinhalt"@de-DE , "Information Content Entity"@en-US , "Information Content Entity"@en .

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        a             obo:BFO_0000001 , obo:BFO_0000020 , vivo:Authorship , vivo:Relationship , obo:BFO_0000002 , owl:Thing ;
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        <http://cris.nrw/hisinone/istOrganisationseinheitVon>
                <https://fis.th-koeln.de/vivo/individual/publ_13324> .

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        rdfs:label  "Publikationen"@de-DE , "Publications"@en-US .